Computador Fanless
Computador Fanless embarcados, expansíveis, plataformas de processamento AMD e Intel, com diversas portas I/Os para aplicações em ambientes hostis, sujeitos a altas temperaturas, poeira, vibração, choques, etc., desenvolvidos para cargas de trabalho que exigem alto desempenho, confiabilidade e durabilidade.
Computador Fanless para para atender as aplicações específicas, fornecendo todas as portas I/Os necessárias, alimentação em AC ou DC, sistema operacional Microsoft Windows IoT e outros componentes que sejam requisitos para o projeto.
Ambientes próprios para utilização de Computador Fanless:
- embarcações navais (navios e barcos);
- trens, ônbius, caminhões, tratores;
- sistema de radares;
- sistemas de cobrança de pedágio (praças de pedágios).
Computador Fanless atualmente disponibilizam processadores de última geração, maior capacidade de memória RAM, podem ser integrados com SSDs e GPUs, sendo uma escolha para uma diversidade de aplicações e ambientes.
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor
- Dual SODIMMs for up to 32GB DDR4
- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0
- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0
- Rich storage: up to 4 internal 2.5″ SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM
- Flexible modular expansion with 2 or 4 slots
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- 6th Generation Intel® Core™ i7/i5/i3 Processors and QM170 chipset
- 2x DDR4 SO-DIMM sockets support up to 32GB memory
- 1x PCI and 2x PCIe Gen3 x8 (or 1x PCIe Gen3 x16) slots
- 2x Mini PCIe and 1x USIM slots
- Support for 3 independent displays with 2x DisplayPort and 1x DVI-I ports
- 3x Intel® GbE LAN ports with teaming function, Intel® iAMT 11.0
- 2x 2.5″ hot-swappable SATA III (6.0 Gb/s) trays on the front panel and 2x internal SATA III (6Gb/s) ports with RAID 0/1/5/10 support
- Remote power on/off switch connector on the front panel
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- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor
- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC
- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0
- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0
- Rich storage options: up to 4x 2.5″ SATA, M.2 2280
- Front accessible I/O and adaptive Function Module 2.0 options
- Flexible functionality expansion: Expansion slots for standard PCIe and PCI card, Embedded slots for Mini PCIe, M.2 3042, 2x USIM
- World leading embedded GP/GPU computing options built-in
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset
- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0
- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0
- Rich storage: 2x 2.5″ SATA 6 Gb/s, CFast, M.2 2280
- Embedded expansion: Mini PCIe, M.2 3042, 2x USIM
- Front accessible I/O and adaptive Function Module v.2 option
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- Built-in ADLINK SEMA 3.0 management solution
- 6th Gen Intel® Core™ i7/i5/i3 Processors and QM170 chipset
- Single-side I/O with two SATA drive bays for easy drive swapping
- 1x DVI-I, 2x DisplayPort, 4x USB 2.0, 4x USB 3.0, 4x GbE ports, 6x COM ports, and 8x isolated DI/O
- Rich Storage Options, 2x 2.5″ SATA III (6.0 Gb/s) bay, 1x M.2 2280 slot, 1x CFast socket
- Versatile connection via 2x mPCIe slot and 2 x USIM slot
- Rugged construction delivering fanless -20°C to 60 (70)°C operability (w/industrial SSD)
- Compliant with railway EMC standard (EN50121)
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- Equipped with 4th generation Intel® Core™ i7-4700EQ processor
- Intel® Quick Sync Video technology supported with ADLINK MSDK+
- Intel® vPro™ technology for security and manageability (iAMT™ 9.0, TPM 1.2, TXT, Intel® VT™)
- Built-in ADLINK SEMA 2.2 (Smart Embedded Management Agent)
- 2x SATA-III (6.0 Gb/s) ports, 2x mPCIe slots (one supporting mSATA SSD)
- DVI-I+2x DisplayPorts, 6x USB 3.0, 4x GbE ports, 8x isolated DI/O
- Rugged design for -20ºC to 60ºC fanless operation (w/industrial SSD
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- 9th Gen Intel® Core™ i7/i5/i3 LGA processor
- Dual SODIMMs sockets for up to 32GB DDR4
- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0
- 3x USB 3.1 Gen 1, 3x USB 2.0
- Rich storage options: 2x 2.5″ SATA, M.2 2280
- Front accessible I/O and adaptive Function Module 2.0 options
- Embedded slots for Mini PCIe, M.2 3042, 2x USIM
- World leading embedded GP/GPU computing options built-in
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- 9th Gen Intel® Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor
- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/ TPM2.0
- 2x USB3.1 Gen2 + 1x USB3.1 Gen1 + 3x USB2.0
- Rich storage:2x 2.5″ SATA, CFast, M.2 2280
- Embedded Expansion: Mini PCIe/ M.2 3042/ 2x USIM
- Front accessible I/O and adaptive Function Module v.2 option
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- Dual-channel DDR4 SO-DIMM sockets support up to 32 GB memory
- 6th Gen Intel® Core™ i7/i5/i3 processors and H110 chipset
- Support for 2x independent displays with 1x VGA, 1x DVI, and 2x DisplayPort
- 3x Intel® GbE ports with teaming function
- 2x software-programmable RS-232/422/485 + 2x RS-232 ports
- Front-mounted I/O for simplified installation and maintenance
- Extremely cost-effective, high performance fanless system
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- Intel® Celeron® QC N3160/DC N3060 SoC processor
- DDR3L 2x SODIMM up to 8GB
- 3x independent displays: DP, VGA (Optional LVDS or DP)
- Built-in ADLINK SEMA management solution
- 3x GbE, 2x RS-232/422/485, 2x RS-232, 4x DI/ 4x DO
- Optional: extra 2x RS-232/422/485, TPM2.0, amplifier
- 2x USB 3.0, 5x USB 2.0, 1x 2.5″ SATA, CFast, Mini PCIe, I2C
- Last generation to support Windows 7 OS
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- Quad-Core Intel® Atom™ E3845 processors
- Single side I/O with easy access SATA drive bay
- Compact 210 (W) x 170 (D) x 70 (H) mm housing
- Built-in ADLINK SEMA management solution
- Rugged construction delivering fanless -40°C to 70°C operability (w/industrial SODIMM & SSD) *
- DVI-I+DisplayPort, 6x USB 2.0, 1x USB 3.0, 3x GbE, 6x COM ports, 16x isolated DI/O, 1x SATA-III (6.0 Gb/s) ports, 2x mPCIe slots
- Ignition power input (with MXE-1401V)
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- Equipped with Intel Atom® x7-E3950/x5-E3930 processors
- Compact fanless design: 140(W) x 110(D) x 58(H) mm
- 1x DisplayPort, 2x USB 2.0, 2x USB 3.0, 2x GbE ports, 2x COM ports (RS-232/422/485)
- 2x mPCIe slots, 1x USIM slot, 1 x mSATA, 1x Micro SD slot
- 1 x 2.5 ” SATA SSD by storage kit or isolated 8x DI/ 8x DO (Optional)
- eSIM support(by project) (Optional)
- Built-in ADLINK SEMA management solution
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